On the 17th of March, 2009, at the ShenzhenAir International Hotel in Shenzhen, China, VIA will host the VIA GMB Tech Forum Spring.

The second VIA Global Mobility Bazaar (GMB) Alliance event, following the first event held in October of last year, the VIA GMB Tech Forum Spring will bring together a host of PC manufacturing and infrastructure partners focused on delivering affordable, power efficient mini-notebooks to global markets.

With a rapidly growing membership that includes leading component vendors such as PQI, SanDisk, American Megatrends (AMI), InnoLux, ITE Tech and TD Hi-Tech, the VIA GMB Alliance seeks to facilitate the swift entry of new players into the popular mini-notebook market, resulting in a broader choice of innovative devices for the consumer.

Over 200 VIA GMB Alliance partners who have registered to attend the VIA GMB Tech Forum Spring will observe live demonstrations of the latest mini-notebook technologies, as well as presentations exploring business and technology trends in the market segment. Topics to be covered include new opportunities for memory module and SSD manufacturers, application utilization tips for embedded controller suppliers, and an overview of a wirelessly networked world and how we go about getting there.

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